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portada Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Type
Physical Book
Author
Publisher
Language
Inglés
Pages
253
Format
Paperback
ISBN13
9781489978011
Edition No.
1
Categories

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

Tae-Kyu Lee (Author) · Thomas R. Bieler (Author) · Choong-Un Kim (Author) · Springer · Paperback

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability - Lee, Tae-Kyu ; Bieler, Thomas R. ; Kim, Choong-Un

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Synopsis "Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability"

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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The binding of this edition is Paperback.

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