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portada Vlsi-Soc: Technology Advancement on Soc Design: 29th Ifip Wg 10.5/IEEE International Conference on Very Large Scale Integration, Vlsi-Soc 2021, Singap (in English)
Type
Physical Book
Publisher
Language
Inglés
Pages
267
Format
Hardcover
Dimensions
23.4 x 15.6 x 1.8 cm
Weight
0.58 kg.
ISBN13
9783031168178

Vlsi-Soc: Technology Advancement on Soc Design: 29th Ifip Wg 10.5/IEEE International Conference on Very Large Scale Integration, Vlsi-Soc 2021, Singap (in English)

Grimblatt, Victor ; Chang, Chip Hong ; Reis, Ricardo (Author) · Springer · Hardcover

Vlsi-Soc: Technology Advancement on Soc Design: 29th Ifip Wg 10.5/IEEE International Conference on Very Large Scale Integration, Vlsi-Soc 2021, Singap (in English) - Grimblatt, Victor ; Chang, Chip Hong ; Reis, Ricardo

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Synopsis "Vlsi-Soc: Technology Advancement on Soc Design: 29th Ifip Wg 10.5/IEEE International Conference on Very Large Scale Integration, Vlsi-Soc 2021, Singap (in English)"

This book contains extended and revised versions of the best papers presented at the 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, held in Singapore, in October 2021*.The 12 full papers included in this volume were carefully reviewed and selected from the 44 papers (out of 75 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.*The conference was held virtually.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.

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