Share
Thermal Buckling Analysis of Rectangular Panels Subjected to Humped Temperature Profile Heating (in English)
Nasa Technical Reports Server (Ntrs)
(Author)
·
William I. Ko
(Author)
·
Bibliogov
· Paperback
Thermal Buckling Analysis of Rectangular Panels Subjected to Humped Temperature Profile Heating (in English) - Ko, William I. ; Nasa Technical Reports Server (Ntrs)
$ 14.95
$ 17.75
You save: $ 2.80
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My WishlistsIt will be shipped from our warehouse between
Tuesday, July 16 and
Wednesday, July 17.
You will receive it anywhere in United States between 1 and 3 business days after shipment.
Synopsis "Thermal Buckling Analysis of Rectangular Panels Subjected to Humped Temperature Profile Heating (in English)"
This research investigates thermal buckling characteristics of rectangular panels subjected to different types of humped temperature profile heating. Minimum potential energy and finite-element methods are used to calculate the panel buckling temperatures. The two methods give fairly close thermal buckling solutions. 'Buckling temperature magnification factor of the first kind, eta' is established for the fixed panel edges to scale up the buckling solution of uniform temperature loading case to give the buckling solution of the humped temperature profile loading cases. Also, 'buckling temperature magnification factor of the second kind, xi' is established for the free panel edges to scale up the buckling solution of humped temperature profile loading cases with unheated boundary heat sinks to give the buckling solutions when the boundary heat sinks are heated up.
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
✓ Producto agregado correctamente al carro, Ir a Pagar.
