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portada Handbook of Electronics Packaging Design and Engineering (in English)
Type
Physical Book
Publisher
Language
Inglés
Pages
472
Format
Paperback
Dimensions
22.9 x 15.2 x 2.5 cm
Weight
0.64 kg.
ISBN13
9789401169813

Handbook of Electronics Packaging Design and Engineering (in English)

Bernard S. Matisoff (Author) · Springer · Paperback

Handbook of Electronics Packaging Design and Engineering (in English) - Matisoff, Bernard S.

Physical Book

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Synopsis "Handbook of Electronics Packaging Design and Engineering (in English)"

The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. It is designed to provide a single convenient source for the solution of re- curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: - Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. - Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. - Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.

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