Share
Die-Stacking Architecture (in English)
Yuan Xie
(Author)
·
Jishen Zhao
(Author)
·
Springer
· Paperback
Die-Stacking Architecture (in English) - Xie, Yuan ; Zhao, Jishen
$ 42.62
$ 44.99
You save: $ 2.37
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My WishlistsIt will be shipped from our warehouse between
Monday, July 15 and
Tuesday, July 16.
You will receive it anywhere in United States between 1 and 3 business days after shipment.
Synopsis "Die-Stacking Architecture (in English)"
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
✓ Producto agregado correctamente al carro, Ir a Pagar.
