Share
amorphous and plycrystalline thin-film silicon science and technology 2008: volume 1066 (in English)
Arokia Nathan
(Illustrated by)
·
Andrew Flewitt
(Illustrated by)
·
Jack Hou
(Illustrated by)
·
Cambridge University Press
· Hardcover
amorphous and plycrystalline thin-film silicon science and technology 2008: volume 1066 (in English) - Nathan, Arokia ; Flewitt, Andrew ; Hou, Jack
$ 112.74
$ 126.00
You save: $ 13.26
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My WishlistsIt will be shipped from our warehouse between
Wednesday, July 03 and
Thursday, July 04.
You will receive it anywhere in United States between 1 and 3 business days after shipment.
Synopsis "amorphous and plycrystalline thin-film silicon science and technology 2008: volume 1066 (in English)"
Amorphous, nano-, micro- and polycrystalline silicon thin films and associated alloys are used in a plethora of applications ranging from active matrix displays and imaging arrays to solar panels. These applications make large-area electronics the fastest growing semiconductor technology today, pushing material requirements and device performance to new limits. This book brings together researchers to share their expertise. Materials addressed include amorphous, nano-, micro- and polycrystalline silicon, and their alloys with germanium, carbon and other elements. Topics include: the understanding of growth processes; producing high-quality films at high growth rates or low temperatures; in situ characterization techniques for monitoring growth; understanding amorphous, mixed-phase and crystalline structures, along with the principles for augmenting crystallinity; developing post-deposition processes; identifying fundamental issues in electronic structure and carrier transport in 3D, 2D and 1D; understanding metastability and the role of hydrogen; integrating photovoltaic devices and thin-film electronics into systems on glass, flexible polymeric and other nonconventional substrates; and designing, fabricating and testing devices and applications.